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          • BOE MLED COB

            Compared with traditional products equipped with front-loaded chips, BOE COB products with RGB full flip chip technology continue to improve the transmittance rate of the black film encapsulation program. It has more outstanding performance due to high protection and high reliability.

            • BOE MLED COB

            • BOE MLED COB

            • BOE MLED COB

          • Product Highlights

          • Cases

          • Product Parameters

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          Product Highlights

          • RGB full flip

            Reduce cost and improve quality

          • Thin Package

            Thinner<250um

          • Black film package

            Continue to improve picture quality

          • Common cathode drive

            Better experience closer to the screen

          • High protection and high reliability

            Reduce transport and maintenance risks

          • Power/Dual-Link solution

            Major projects are guaranteed

          • Overseas qualification

            Products are available for sale overseas

          • Curved splicing

            Enable multiple scenarios

          Product Parameters

          BYH-COB
          Specifications BYH009 Ultra BYH009V1 BYH012V1 BYH015V1
          Pitch 0.9375 0.9375 1.25 1.5
          Module Size（mm） 150*337.5 150*168.75
          Cabinet Dimension（mm） 600*337.5 600*337.5
          Maintenance Mode Front
          Cabinet flatness（mm） ≤0.1
          White balance brightness（cd/m2） Typ 1500 Typ 600, 0 - 800 Adjustable
          Refresh Rate（Hz） 7680 3840
          Installation mode Stacking & Wall mounting

          * Please click on the bottom of the project for more product details.

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